Summary: We analyze the thermo-elastic behavior of an elliptical nano-inclusion incorporating interface conduction and interface stress effects when embedded in an infinite matrix under plane deformation. The effect of interface conduction is represented by a highly conductive interface model, while that of interface stress is described via the complete version of the Gurtin-Murdoch model with the residual interface tension. Based on the complex variable method, we obtain, for the case of a constant heat flux applied remotely on the matrix, the uncoupled steady-state temperature field and thermal stress field using conformal mapping and series expansion techniques. We present also a group of numerical examples to illustrate the influence of interface conduction and interface effects on the stress field around the inclusion relative to the aspect ratio and relative stiffness of the inclusion.