Iterative boundary element method for crack analysis of two-dimensional piezoelectric semiconductor. (English) Zbl 1403.74264
Summary: Based on the well-developed boundary element methods for piezoelectric media and conductors, we present an iterative boundary element method to solve the boundary value problems in two-dimensional piezoelectric semiconductors (PSCs). The proposed method is verified by analyzing a piezoelectric semiconductor plate under multi-field load. Two typically important boundary value problems, a hole and a crack, are studied in PSC plates by using the proposed method. The stress concentration near the edge of an elliptical hole in a finite piezoelectric semiconductor plate is studied by using the single-domain boundary element method. Also, by using the sub-domain boundary element method, we analyzed how the mechanical load, electrical load, electric current density, and initial electron density affected the stress, electric displacement and electric current intensity factors near the crack tip.
MSC:
| 74S15 | Boundary element methods applied to problems in solid mechanics |
| 65N38 | Boundary element methods for boundary value problems involving PDEs |
| 74F15 | Electromagnetic effects in solid mechanics |
| 74R10 | Brittle fracture |
Keywords:
piezoelectric semiconductors; iterative boundary element method; elliptical hole; crack; intensity factorsReferences:
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