Palo Alto, California, United States Contact Info
8K followers 500+ connections

Join to view profile

About

I'm a renewable energy industry executive committed to accelerating the deployment of…

Activity

Join now to see all activity

Experience & Education

  • Antora Energy

View Ty’s full experience

See their title, tenure and more.

or

By clicking Continue to join or sign in, you agree to LinkedIn’s User Agreement, Privacy Policy, and Cookie Policy.

Volunteer Experience

  • Founder, Executive Director

    CarbonTaxNow.org

    - Present 10 years 11 months

    I started this non-profit to address the current global climate change crises. After serving in the solar/renewables industry for a couple of decades, it has become clear that renewable energy deployment -- even at the current escalating rate -- will not save our planet. We need broad-based, simple, transparent and unified global policies to combat climate change, and this probably means a web of carbon-pricing initiatives at local and national levels.

    The current primary global…

    I started this non-profit to address the current global climate change crises. After serving in the solar/renewables industry for a couple of decades, it has become clear that renewable energy deployment -- even at the current escalating rate -- will not save our planet. We need broad-based, simple, transparent and unified global policies to combat climate change, and this probably means a web of carbon-pricing initiatives at local and national levels.

    The current primary global bottleneck to such an initiative is the will of the voters everywhere; the goal of CarbonTaxNow.org is to educate and -- yes -- "popularize" the idea of carbon taxation so as to make it politically viable for politicians to support.

    Show your support today by taking our 20-year pledge at www.carbontaxnow.org.

Patents

  • Energy Grid Data Platform

    Issued US 10,163,242

    Techniques are disclosed for an energy grid data platform through which information associated with an electrical grid can be accessed by one or more entities. In some embodiments, an energy grid data platform includes one or more modeling engines configured to receive data associated with an electrical grid and generate data models describing various aspects of the electrical grid. For example an electrical grid model describing the state of the electrical grid at one or more points of…

    Techniques are disclosed for an energy grid data platform through which information associated with an electrical grid can be accessed by one or more entities. In some embodiments, an energy grid data platform includes one or more modeling engines configured to receive data associated with an electrical grid and generate data models describing various aspects of the electrical grid. For example an electrical grid model describing the state of the electrical grid at one or more points of connection may be based at least in part on data received from sensors at the edge of the electrical grid. As another example, a physical grid model describing the physical arrangement and logical relationships between physical objects associated with the electrical grid can be generated based at least in part on received imagery data. In some embodiments, aspects of an electrical grid model and physical grid model can be combined into an operational grid model that associates real-time operating information with the certain identified physical objects associated with the electrical grid. Information based on the one or more generated models of the electrical grid can be accessed via the energy grid platform as a cloud-based service, for example, via a web interface or an augmented reality display device.

    See patent

  • Latching Structure and a Method of Making an Electrical Interconnect

    US 7674142

    An electrical interconnect device attaches electrical devices with a cantilever spring with out the use of solder or adhesive. The cantilever spring latches to a contact structure such that there are a plurality of contact points between the spring and the contact structure. The cantilever spring has two tines at a tip end that define an opening in the spring. The contact structure is received by the opening between the two tines so that the spring and the contact structure mate. The spring may…

    An electrical interconnect device attaches electrical devices with a cantilever spring with out the use of solder or adhesive. The cantilever spring latches to a contact structure such that there are a plurality of contact points between the spring and the contact structure. The cantilever spring has two tines at a tip end that define an opening in the spring. The contact structure is received by the opening between the two tines so that the spring and the contact structure mate. The spring may engage the contact structure by latching to the contact structure or by a post that urges the tip end of the spring against the contact structure.

    Other inventors
    • Others
    See patent

  • Micro-Machined Structure Production Using Encapsulation

    US 7356920

    Micro-machined (e.g., stress-engineered spring) structures are produced by forming a release layer, forming a partially or fully encapsulated beam/spring structure, and then releasing the beam/spring structure by etching the release layer. The encapsulation structure protects the beam/spring during release, so both the release layer and the beam/spring can be formed using plating and/or using the same material. The encapsulation structure can be metal, resist, polymer, oxide, or nitride, and…

    Micro-machined (e.g., stress-engineered spring) structures are produced by forming a release layer, forming a partially or fully encapsulated beam/spring structure, and then releasing the beam/spring structure by etching the release layer. The encapsulation structure protects the beam/spring during release, so both the release layer and the beam/spring can be formed using plating and/or using the same material. The encapsulation structure can be metal, resist, polymer, oxide, or nitride, and may be removed after the release process, or retained as part of the completed micro-machined structure.

    Other inventors
    • Others
    See patent

  • Micro-Machined Structure Production Using Encapsulation

    US 8080293

    Micro-machined (e.g., stress-engineered spring) structures are produced by forming a release layer, forming a partially or fully encapsulated beam/spring structure, and then releasing the beam/spring structure by etching the release layer. The encapsulation structure protects the beam/spring during release, so both the release layer and the beam/spring can be formed using plating and/or using the same material. The encapsulation structure can be metal, resist, polymer, oxide, or nitride, and…

    Micro-machined (e.g., stress-engineered spring) structures are produced by forming a release layer, forming a partially or fully encapsulated beam/spring structure, and then releasing the beam/spring structure by etching the release layer. The encapsulation structure protects the beam/spring during release, so both the release layer and the beam/spring can be formed using plating and/or using the same material. The encapsulation structure can be metal, resist, polymer, oxide, or nitride, and may be removed after the release process, or retained as part of the completed micro-machined structure.

    Other inventors
    • others
    See patent

  • Micro-Machined Structure Production Using Encapsulation

    US 7730615

    Micro-machined (e.g., stress-engineered spring) structures are produced by forming a release layer, forming a partially or fully encapsulated beam/spring structure, and then releasing the beam/spring structure by etching the release layer. The encapsulation structure protects the beam/spring during release, so both the release layer and the beam/spring can be formed using plating and/or using the same material. The encapsulation structure can be metal, resist, polymer, oxide, or nitride, and…

    Micro-machined (e.g., stress-engineered spring) structures are produced by forming a release layer, forming a partially or fully encapsulated beam/spring structure, and then releasing the beam/spring structure by etching the release layer. The encapsulation structure protects the beam/spring during release, so both the release layer and the beam/spring can be formed using plating and/or using the same material. The encapsulation structure can be metal, resist, polymer, oxide, or nitride, and may be removed after the release process, or retained as part of the completed micro-machined structure.

    Other inventors
    • Others
    See patent

  • Micro-machined structure production using encapsulation

    US 8,435,612

    Micro-machined (e.g., stress-engineered spring) structures are produced by forming a release layer, forming a partially or fully encapsulated beam/spring structure, and then releasing the beam/spring structure by etching the release layer. The encapsulation structure protects the beam/spring during release, so both the release layer and the beam/spring can be formed using plating and/or using the same material. The encapsulation structure can be metal, resist, polymer, oxide, or nitride, and…

    Micro-machined (e.g., stress-engineered spring) structures are produced by forming a release layer, forming a partially or fully encapsulated beam/spring structure, and then releasing the beam/spring structure by etching the release layer. The encapsulation structure protects the beam/spring during release, so both the release layer and the beam/spring can be formed using plating and/or using the same material. The encapsulation structure can be metal, resist, polymer, oxide, or nitride, and may be removed after the release process, or retained as part of the completed micro-machined structure.

    See patent

Honors & Awards

  • Initiative for Global Environmental Leadership, Alumni Advisory Group

    Wharton School of Business

Languages

  • English

    Native or bilingual proficiency

  • Russian

    Professional working proficiency

Recommendations received

1 person has recommended Ty

Join now to view

More activity by Ty

View Ty’s full profile

  • See who you know in common
  • Get introduced
  • Contact Ty directly
Join to view full profile

Other similar profiles

Explore more posts

Explore collaborative articles

We’re unlocking community knowledge in a new way. Experts add insights directly into each article, started with the help of AI.

Explore More

Others named Ty Jagerson

1 other named Ty Jagerson is on LinkedIn

See others named Ty Jagerson

Add new skills with these courses

See all courses