SEM in-situ investigation on failure of nanometallic film/substrate structures under three-point bending loading. (English) Zbl 1419.74026
Summary: Three-point bending tests on nanocrystalline Cu or Cu/Ni-film/Cu-substrate samples were conducted in-situ with scanning electron microscopy (SEM) observations. The SEM in-situ observations show undulation deformation of the surface of thin film, as the thin film fractures easily at the concave-convex points of deformation and multi-cracks appear on the surface of the thin film in a periodic fashion. The critical wavelength of undulation is calculated based on experimental observations, which are comparable with the theoretical predictions. For the Cu/Ni multi-layered films/substrate structures, the micro-cracking pattern depends on the interfacial strength between the film and the substrate, rather than the interfacial strength between the layers of films.
MSC:
| 74-05 | Experimental work for problems pertaining to mechanics of deformable solids |
| 74K35 | Thin films |
| 74R99 | Fracture and damage |
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