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Assessment of an active-cooling micro-channel heat sink device, using electro-osmotic flow. (English) Zbl 1227.80003

Summary: Non-uniform heat flux generated by microchips causes “hot spots” in very small areas on the microchip surface. These hot spots are generated by the logic blocks in the microchip bay; however, memory blocks generate lower heat flux on contrast. The goal of this research is to design, fabricate, and test an active cooling micro-channel heat sink device that can operate under atmospheric pressure while achieving high-heat dissipation rate with a reduced chip-backside volume, particularly for spot cooling applications. An experimental setup was assembled and electro-osmotic flow (EOF) was used thus eliminating high pressure pumping system. A flow rate of \(82 \mu \)L/min was achieved at 400 V of applied EOF voltage. An increase in the cooling fluid (buffer) temperature of 9.6 \(^\circ \)C, 29.9 \(^\circ \)C, 54.3 \(^\circ \)C, and 80.1 \(^\circ \)C was achieved for 0.4 W, 1.2 W, 2.1 W, and 4 W of heating powers, respectively. The substrate temperature at the middle of the microchannel was below 80.5 \(^\circ \)C for all input power values. The maximum increase in the cooling fluid temperature due to the joule heating was 4.5 \(^\circ \)C for 400 V of applied EOF voltage. Numerical calculations of temperatures and flow were conducted and the results were compared to experimental data. Nusselt number (Nu) for the 4 W case reached a maximum of 5.48 at the channel entrance and decreased to reach 4.56 for the rest of the channel. Nu number for EOF was about 10% higher when compared to the pressure driven flow. It was found that using a shorter channel length and an EOF voltage in the range of 400 – 600 V allows application of a heat flux in the order of \(10^{4} W/m^{2}\), applicable to spot cooling. For elevated voltages, the velocity due to EOF increased, leading to an increase in total heat transfer for a fixed duration of time; however, the joule heating also got elevated with increase in voltage.

MSC:

80A20 Heat and mass transfer, heat flow (MSC2010)
76D05 Navier-Stokes equations for incompressible viscous fluids
76W05 Magnetohydrodynamics and electrohydrodynamics
80M12 Finite volume methods applied to problems in thermodynamics and heat transfer
76M12 Finite volume methods applied to problems in fluid mechanics
35Q30 Navier-Stokes equations
Full Text: DOI

References:

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