ARTICLE
|
doi:10.20944/preprints202306.1796.v1
Subject:
Engineering,
Electrical And Electronic Engineering
Keywords:
Induction heating; rapid heating; power electronics; die-attach; chip bonding; power electronic packaging; electromagnetic field; (silver) sintering; particle bonding; DBC
Online: 26 June 2023 (10:51:59 CEST)