The monolithic 3D integration of 2D molybdenum disulfide memtransistors and graphene chemitransistors can be used to create near-sensor computing chips with high interconnect density and a vertical separation between tiers of less than 50 nm.
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Han, S., Moon, JY. & Bae, SH. Monolithic 3D integration with 2D materials. Nat Electron 7, 854–855 (2024). https://doi.org/10.1038/s41928-024-01260-7
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DOI: https://doi.org/10.1038/s41928-024-01260-7
