Using the boundary scan delay chain for cross-chip delay measurement and characterization of delay modeling flow
J Schmid, T Schuring, C Smalla�- Proceedings of the IEEE 2001�…, 2001 - ieeexplore.ieee.org
For ASICs/SOCs/lCs it is often very important to have an easily accessible delay
measurements path for several reasons. The delay of a long path running across the whole
chip through lots of instances (inverters, MUXes) makes it possible to measure the final
process parameters of an ASIC/IC within the best and worst case production process
window. This information is very important for production testing and assembly at the vendor
site. But very often this information is also necessary at circuit pack level, system test level�…
measurements path for several reasons. The delay of a long path running across the whole
chip through lots of instances (inverters, MUXes) makes it possible to measure the final
process parameters of an ASIC/IC within the best and worst case production process
window. This information is very important for production testing and assembly at the vendor
site. But very often this information is also necessary at circuit pack level, system test level�…
Using the Boundary Scan Delay Chain for Cross-Chip Delay Measurement and Characterization of Delay Modeling Flow
C Smalla�- Proceedings of the 2nd International Symposium on�…, 2001 - dl.acm.org
For ASICs/SOCs/ICs it is often very important to have an easy accessible delay
measurement path for several reasons. The delay of a long path running across the whole
chip through lots of instances (inverters, MUXes) makes it possible to measure the final
process parameters of an ASIC/IC within the best and worst case production process
window. This information is very important for production testing and assembly at the vendor
site. But very often this information is also necessary at circuit pack level, system test level�…
measurement path for several reasons. The delay of a long path running across the whole
chip through lots of instances (inverters, MUXes) makes it possible to measure the final
process parameters of an ASIC/IC within the best and worst case production process
window. This information is very important for production testing and assembly at the vendor
site. But very often this information is also necessary at circuit pack level, system test level�…
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