III–V micromachined devices for microsystems
JL Leclercq, RP Ribas, JM Karam, P Viktorovitch�- Microelectronics Journal, 1998 - Elsevier
This paper aims to present a brief review on the specific features and advantages of the III–V
micromachined devices for microsystems, making them an attractive alternative to the well …
micromachined devices for microsystems, making them an attractive alternative to the well …
[BOOK][B] Influence of temperature on microelectronics and system reliability: A physics of failure approach
This book raises the level of understanding of thermal design criteria. It provides the design
team with sufficient knowledge to help them evaluate device architecture trade-offs and the …
team with sufficient knowledge to help them evaluate device architecture trade-offs and the …
Polymer self assembly in semiconductor microelectronics
We are inspired by the beauty and simplicity of self-organizing materials and the promise they
hold for enabling continued improvements in semiconductor technology. Self assembly is …
hold for enabling continued improvements in semiconductor technology. Self assembly is …
Are sintered silver joints ready for use as interconnect material in microelectronic packaging?
KS Siow�- Journal of electronic materials, 2014 - Springer
Silver (Ag) has been under development for use as interconnect material for power electronics
packaging since the late 1980s. Despite its long development history, high thermal and …
packaging since the late 1980s. Despite its long development history, high thermal and …
Why can Smart Cut� change the future of microelectronics?
AJ Auberton-Herve, M Bruel�- International journal of high speed�…, 2000 - World Scientific
Deposition techniques like chemical vapor deposition (CVD) offer to the semiconductor industry
the initial flexibility to deposit thin films of key materials on many kinds of substrates. The …
the initial flexibility to deposit thin films of key materials on many kinds of substrates. The …
Low dielectric constant materials for microelectronics
The ever increasing requirements for electrical performance of on-chip wiring has driven
three major technological advances in recent years. First, copper has replaced Aluminum as …
three major technological advances in recent years. First, copper has replaced Aluminum as …
Review on micro-and nanolithography techniques and their applications
A Pimpin, W Srituravanich�- Engineering journal, 2012 - engj.org
This article reviews major micro-and nanolithography techniques and their applications from
commercial micro devices to emerging applications in nanoscale science and engineering. …
commercial micro devices to emerging applications in nanoscale science and engineering. …
Recent advances in wire bonding, flip chip and lead‐free solder for advanced microelectronics packaging
ZW Zhong, TY Tee, JE Luan�- Microelectronics International, 2007 - emerald.com
… Manufacturing of microelectronics devices with finer pitches and higher circuitry integration
is also a trend in the microelectronics industry. More and more devices require higher I/O (…
is also a trend in the microelectronics industry. More and more devices require higher I/O (…
Conducting polymers in microelectronics
M Angelopoulos�- IBM journal of research and development, 2001 - ieeexplore.ieee.org
Conjugated polymers in the nondoped and doped conducting state have an array of potential
applications in the microelectronics industry. Conducting polymers are effective discharge …
applications in the microelectronics industry. Conducting polymers are effective discharge …
Lithium and lithium ion batteries for applications in microelectronic devices: A review
Batteries employing lithium chemistry have been intensively investigated because of their
high energy attributes which may be deployed for vehicle electrification and large-scale …
high energy attributes which may be deployed for vehicle electrification and large-scale …
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