Fast electromigration stress analysis using Low-Rank Balanced Truncation for general interconnect and power grid structures
Electromigration (EM) has become one of the most significant challenges considering
longterm reliability in integrated circuit design. The problem is caused by the large current
density in circuit interconnections. However, in most cases, we are interested in the EM
stress at specific points of the interconnect, such as vias, junctions and boundaries. As a
result, Model Order Reduction (MOR) techniques can provide attractive methodologies to
reduce the complexity of the original systems. System-theoretic techniques like Balanced�…
longterm reliability in integrated circuit design. The problem is caused by the large current
density in circuit interconnections. However, in most cases, we are interested in the EM
stress at specific points of the interconnect, such as vias, junctions and boundaries. As a
result, Model Order Reduction (MOR) techniques can provide attractive methodologies to
reduce the complexity of the original systems. System-theoretic techniques like Balanced�…
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