Abstract
An analytical model is presented that can account for both electrical and hot and cold thermal contact resistances when calculating the efficiency of a thermoelectric generator. The model is compared to a numerical model of a thermoelectric leg for 16 different thermoelectric materials, as well as to the analytical models of Ebling et al. (J Electron Mater 39:1376, 2010) and Min and Rowe (J Power Sour 38:253, 1992). The model presented here is shown to accurately calculate the efficiency for all systems and all contact resistances considered, with an average difference in efficiency between the numerical model and the analytical model of −0.07 ± 0.35pp. This makes the model more accurate than previously published models. The maximum absolute difference in efficiency between the analytical model and the numerical model is 1.14pp for all materials and all contact resistances considered.
Similar content being viewed by others
References
P. Ziolkowski, P. Poinas, J. Leszczynski, G. Karpinski, and E. Mller, J. Electron. Mater. 39, 1934 (2010)
R. Bjørk, D.V. Christensen, D. Eriksen, and N. Pryds, Int. J. Therm. Sci. 85, 12 (2014)
M.S. El-Genk, and H.H. Saber, Energy Convers. Manag. 44, 1069 (2003)
M.S. El-Genk, H.H. Saber, and T. Caillat, AIP Conference Proceedings, vol. 699, p. 541 (2004)
M.S. El-Genk, H.H. Saber, T. Caillat, and J. Sakamoto, Energy. Convers. Manag. 47, 174 (2006)
J. DAngelo, E.D. Case, N. Matchanov, C.-I. Wu, T.P. Hogan, J. Barnard, C. Cauchy, T. Hendricks, and M.G. Kanatzidis, J. Electron. Mater. 40, 2051 (2011)
L.T. Hung, N.V. Nong, G.J. Snyder, B. Balke, L. Han, R. Bjørk, P.H. Ngan, T.C. Holgate, S. Linderoth, and N. Pryds, Energy Technol. (2015). doi:10.1002/ente.201500176
T. Sakamoto, T. Iida, Y. Honda, M. Tada, T. Sekiguchi, K. Nishio, Y. Kogo, and Y. Takanashi, J. Electron. Mater. 41, 1805 (2012)
J.J. D’Angelo, E.J. Timm, F. Ren, B.D. Hall, E. Case, H. Schock, M. Kanatzidis, D.Y. Chung, and T.P. Hogan, MRS Proceedings, vol. 1044, p. 1044 (2007)
F. Assion, M. Schönhoff, and U. Hilleringmann, J. Electron. Mater. 42, 1932 (2013)
Y.X. Gan, and F.W. Dynys, Mater. Chem. Phys. 138, 342 (2013)
F. Li, X. Huang, W. Jiang, and L. Chen, 9th European Conference on Thermoelectrics, vol. 1449, p. 458 (2012)
D. Zhao, H. Geng, and L. Chen, Int. J. Appl. Ceram. Technol. 9, 733 (2012)
R. Zybała, K. Wojciechowski, M. Schmidt, and R. Mania, Ceram. Mater. 62, 481 (2010)
A. Pettes, R. Melamud, S. Higuchi, and K. Goodson, Proceedings on International Conference on Thermoelectrics (IEEE), pp. 283–289 (2007)
D. Ebling, K. Bartholom, M. Bartel, and M. Jgle, J. Electron. Mater. 39, 1376 (2010)
B. Reddy, M. Barry, J. Li, and M.K. Chyu, J. Heat Transf. 136, 101401 (2014)
R. Bjørk, J. Electron. Mater. 44, 2869 (2015)
G. Min, and D.M. Rowe, J. Power Sour. 38, 253 (1992)
D.M. Rowe, and G. Min, IEE Proc. Sci. Meas. Technol. 143, 351 (1996)
D.M. Rowe, Thermoelectrics Handbook—Macro to Nano (Taylor and Francis Group, LLC, Boca Raton, 2006)
Y. Ma, Q. Hao, B. Poudel, Y. Lan, B. Yu, D. Wang, G. Chen, and Z. Ren, Nano Lett. 8, 2580 (2008)
A. Muto, J. Yang, B. Poudel, Z. Ren, and G. Chen, Adv. Energy Mater. 3, 245 (2013)
E.S. Toberer, C.A. Cox, S.R. Brown, T. Ikeda, A.F. May, S.M. Kauzlarich, and G.J. Snyder, Adv. Funct. Mater. 18, 2795 (2008)
X. Yan, G. Joshi, W. Liu, Y. Lan, H. Wang, S. Lee, J. Simonson, S. Poon, T. Tritt, G. Chen, and Z. Ren, Nano Lett. 11, 556 (2010)
Y. Pei, A.D. LaLonde, N.A. Heinz, X. Shi, S. Iwanaga, H. Wang, L. Chen, and G.J. Snyder, Adv. Mater. 23, 5674 (2011)
M. Chitroub, F. Besse, and H. Scherrer, J. Alloy Compd. 460, 90 (2008)
H. Liu, X. Shi, F. Xu, L. Zhang, W. Zhang, L. Chen, Q. Li, C. Uher, T. Day, and G.J. Snyder, Nat. Mater. 11, 422 (2012)
G. Joshi, H. Lee, Y. Lan, X. Wang, G. Zhu, D. Wang, R.W. Gould, D.C. Cuff, M.Y. Tang, M.S. Dresselhaus, G. Chen, and Z. Ren, Nano Lett. 8, 4670 (2008)
C. Kim, D.H. Kim, H. Kim, and J.S. Chung, ACS Appl. Mater. Interfaces 4, 2949 (2012)
M. Schwall, and B. Balke, Phys. Chem. Chem. Phys. 15, 1868 (2013)
X. Shi, J. Yang, S. Bai, J. Yang, H. Wang, M. Chi, J.R. Salvador, W. Zhang, L. Chen, and W. Wong-Ng, Adv. Funct. Mater. 20, 755 (2010)
Q. Zhang, J. He, T. Zhu, S. Zhang, X. Zhao, and T. Tritt, Appl. Phys. Lett. 93, 102109 (2008)
A.D. LaLonde, Y. Pei, and G.J. Snyder, Energy Environ. Sci. 4, 2090 (2011)
X. Shi, J. Yang, J.R. Salvador, M. Chi, J.Y. Cho, H. Wang, S. Bai, J. Yang, W. Zhang, and L. Chen, J. Am. Chem. Soc. 133, 7837 (2011)
A.F. May, J.-P. Fleurial, and G.J. Snyder, Chem. Mater. 22, 2995 (2010)
X. Wang, H. Lee, Y. Lan, G. Zhu, G. Joshi, D. Wang, J. Yang, A. Muto, M. Tang, J. Klatsky, S.S.M. Dresselhaus, G. Chen, and Z. Ren, Appl. Phys. Lett. 93, 193121 (2008)
P.H. Ngan, D.V. Christensen, G.J. Snyder, L.T. Hung, S. Linderoth, N.V. Nong, and N. Pryds, Phys. Status Solidi A 211, 9 (2014)
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
About this article
Cite this article
Bjørk, R. An Analytical Model for the Influence of Contact Resistance on Thermoelectric Efficiency. J. Electron. Mater. 45, 1301–1308 (2016). https://doi.org/10.1007/s11664-015-4014-z
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s11664-015-4014-z