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Electronics design and testing of the CMS Fast Beam Condition Monitor for HL-LHC
Authors:
K. Shibin,
G. Auzinger,
H. Bakhshiansohi,
A. Dabrowski,
A. Dierlamm,
M. Dragicevic,
A. Gholami,
G. Gomez,
M. Guthoff,
M. Haranko,
A. Homna,
M. Jenihhin,
J. Kaplon,
O. Karacheban,
B. Korcsmáros,
A. Lokhovitskiy,
R. Loos,
S. Mallows,
J. Michel,
V. Myronenko,
G. Pásztor,
J. Schwandt,
M. Sedghi,
A. Shevelev,
G. Steinbrueck
, et al. (2 additional authors not shown)
Abstract:
The high-luminosity upgrade of the LHC (HL-LHC) brings unprecedented requirements for precision bunch-by-bunch luminosity measurement and beam-induced background monitoring in real time. A key component of the CMS Beam Radiation Instrumentation and Luminosity detector system is a stand-alone luminometer, the Fast Beam Condition Monitor (FBCM), which is able to operate independently at all times wi…
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The high-luminosity upgrade of the LHC (HL-LHC) brings unprecedented requirements for precision bunch-by-bunch luminosity measurement and beam-induced background monitoring in real time. A key component of the CMS Beam Radiation Instrumentation and Luminosity detector system is a stand-alone luminometer, the Fast Beam Condition Monitor (FBCM), which is able to operate independently at all times with a triggerless asynchronous readout. FBCM utilizes a dedicated front-end ASIC to amplify the signals from CO$_2$-cooled silicon-pad sensors with 1 ns timing resolution. Front-end (FE) electronics are subject to high-radiation conditions, thus all components are radiation hardened: sensors, ASICs, transceivers, etc. The FBCM ASIC contains 6 channels, each outputting a high-speed binary signal carrying the time-of-arrival and time-over-threshold information. This signal is sent via a gigabit optical link to the back-end electronics for analysis. A dedicated test system is designed for the FBCM FE electronics with a modular setup for all testing needs of the project from initial ASIC validation test to system-level testing with the full read-out chain. The paper reports on the design, read-out architecture, and testing program for the FBCM electronics.
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Submitted 18 October, 2024;
originally announced October 2024.
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The CMS Fast Beam Condition Monitor for HL-LHC
Authors:
G. Auzinger,
H. Bakhshiansohi,
A. Dabrowski,
A. G. Delannoy,
A. Dierlamm,
M. Dragicevic,
A. Gholami,
G. Gomez,
M. Guthoff,
M. Haranko,
A. Homna,
M. Jenihhin,
J. Kaplon,
O. Karacheban,
B. Korcsmáros,
W. H. Liu,
A. Lokhovitskiy,
R. Loos,
S. Mallows,
J. Michel,
V. Myronenko,
G. Pásztor,
M. Pari,
J. Schwandt,
M. Sedghi
, et al. (6 additional authors not shown)
Abstract:
The high-luminosity upgrade of the LHC brings unprecedented requirements for real-time and precision bunch-by-bunch online luminosity measurement and beam-induced background monitoring. A key component of the CMS Beam Radiation, Instrumentation and Luminosity system is a stand-alone luminometer, the Fast Beam Condition Monitor (FBCM), which is fully independent from the CMS central trigger and dat…
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The high-luminosity upgrade of the LHC brings unprecedented requirements for real-time and precision bunch-by-bunch online luminosity measurement and beam-induced background monitoring. A key component of the CMS Beam Radiation, Instrumentation and Luminosity system is a stand-alone luminometer, the Fast Beam Condition Monitor (FBCM), which is fully independent from the CMS central trigger and data acquisition services and able to operate at all times with a triggerless readout. FBCM utilizes a dedicated front-end application-specific integrated circuit (ASIC) to amplify the signals from CO$_2$-cooled silicon-pad sensors with a timing resolution of a few nanoseconds, which enables the measurement of the beam-induced background. FBCM uses a modular design with two half-disks of twelve modules at each end of CMS, with four service modules placed close to the outer edge to reduce radiation-induced aging. The electronics system design adapts several components from the CMS Tracker for power, control and read-out functionalities. The dedicated FBCM23 ASIC contains six channels and adjustable shaping time to optimize the noise with regards to sensor leakage current. Each ASIC channel outputs a single binary high-speed asynchronous signal carrying time-of-arrival and time-over-threshold information. The chip output signal is digitized, encoded and sent via a radiation-hard gigabit transceiver and an optical link to the back-end electronics for analysis. This paper reports on the updated design of the FBCM detector and the ongoing testing program.
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Submitted 6 February, 2024;
originally announced February 2024.
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The optimization, design and performance of the FBCM23 ASIC for the upgraded CMS beam monitoring system
Authors:
Jan Kaplon,
Grzegorz Wegrzyn,
Konstantin Shibin,
Marnix Barendregt
Abstract:
We present the development of the FBCM23 ASIC designed for the Phase-II upgrade of the Fast Beam Condition Monitoring (FBCM) system built at the CMS experiment which will replace the present luminometer based on the BCM1F ASIC [1]. The FBCM system should provide reliable luminosity measurement with 1ns time resolution enabling the detection of beam-induced background. The FBCM23 ASIC comprises 6 c…
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We present the development of the FBCM23 ASIC designed for the Phase-II upgrade of the Fast Beam Condition Monitoring (FBCM) system built at the CMS experiment which will replace the present luminometer based on the BCM1F ASIC [1]. The FBCM system should provide reliable luminosity measurement with 1ns time resolution enabling the detection of beam-induced background. The FBCM23 ASIC comprises 6 channels of the fast front-end amplifier working in transimpedance configuration, booster amplifier, and leading edge discriminator. The complete processing chain provides an overall shaping function equivalent to the CR-RC$^3$ filter. The paper will show the optimization of the design, overall architecture, and the detailed implementation in a CMOS 65nm process as well as preliminary electrical performance.
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Submitted 26 January, 2024; v1 submitted 5 December, 2023;
originally announced December 2023.
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On-Chip Sensors Data Collection and Analysis for SoC Health Management
Authors:
Konstantin Shibin,
Maksim Jenihhin,
Artur Jutman,
Sergei Devadze,
Anton Tsertov
Abstract:
Data produced by on-chip sensors in modern SoCs contains a large amount of information such as occurring faults, aging status, accumulated radiation dose, performance characteristics, environmental and other operational parameters. Such information provides insight into the overall health of a system's hardware as well as the operability of individual modules. This gives a chance to mitigate fault…
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Data produced by on-chip sensors in modern SoCs contains a large amount of information such as occurring faults, aging status, accumulated radiation dose, performance characteristics, environmental and other operational parameters. Such information provides insight into the overall health of a system's hardware as well as the operability of individual modules. This gives a chance to mitigate faults and avoid using faulty units, thus enabling hardware health management. Raw data from embedded sensors cannot be immediately used to perform health management tasks. In most cases, the information about occurred faults needs to be analyzed taking into account the history of the previously reported fault events and other collected statistics. For this purpose, we propose a special structure called Health Map (HM) that holds the information about functional resources, occurring faults and maps relationships between these. In addition, we propose algorithms for aggregation and classification of data received from on-chip sensors. The proposed Health Map contains detailed information on a particular system level (e.g., module, SoC, board) that can be compiled into a summary of hardware health status that in its turn enables distributed hierarchical health management by using this information at a higher level of system hierarchy, thus increasing the system's availability and effective lifetime.
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Submitted 30 August, 2023;
originally announced August 2023.
