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A tabletop x-ray tomography instrument for nanometer-scale imaging: demonstration of the 1,000-element transition-edge sensor subarray
Authors:
Paul Szypryt,
Nathan Nakamura,
Daniel T. Becker,
Douglas A. Bennett,
Amber L. Dagel,
W. Bertrand Doriese,
Joseph W. Fowler,
Johnathon D. Gard,
J. Zachariah Harris,
Gene C. Hilton,
Jozsef Imrek,
Edward S. Jimenez,
Kurt W. Larson,
Zachary H. Levine,
John A. B. Mates,
D. McArthur,
Luis Miaja-Avila,
Kelsey M. Morgan,
Galen C. O'Neil,
Nathan J. Ortiz,
Christine G. Pappas,
Daniel R. Schmidt,
Kyle R. Thompson,
Joel N. Ullom,
Leila Vale
, et al. (6 additional authors not shown)
Abstract:
We report on the 1,000-element transition-edge sensor (TES) x-ray spectrometer implementation of the TOMographic Circuit Analysis Tool (TOMCAT). TOMCAT combines a high spatial resolution scanning electron microscope (SEM) with a highly efficient and pixelated TES spectrometer to reconstruct three-dimensional maps of nanoscale integrated circuits (ICs). A 240-pixel prototype spectrometer was recent…
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We report on the 1,000-element transition-edge sensor (TES) x-ray spectrometer implementation of the TOMographic Circuit Analysis Tool (TOMCAT). TOMCAT combines a high spatial resolution scanning electron microscope (SEM) with a highly efficient and pixelated TES spectrometer to reconstruct three-dimensional maps of nanoscale integrated circuits (ICs). A 240-pixel prototype spectrometer was recently used to reconstruct ICs at the 130 nm technology node, but to increase imaging speed to more practical levels, the detector efficiency needs to be improved. For this reason, we are building a spectrometer that will eventually contain 3,000 TES microcalorimeters read out with microwave superconducting quantum interference device (SQUID) multiplexing, and we currently have commissioned a 1,000 TES subarray. This still represents a significant improvement from the 240-pixel system and allows us to begin characterizing the full spectrometer performance. Of the 992 maximimum available readout channels, we have yielded 818 devices, representing the largest number of TES x-ray microcalorimeters simultaneously read out to date. These microcalorimeters have been optimized for pulse speed rather than purely energy resolution, and we measure a FWHM energy resolution of 14 eV at the 8.0 keV Cu K$α$ line.
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Submitted 22 December, 2022;
originally announced December 2022.
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Nanoscale Three-Dimensional Imaging of Integrated Circuits using a Scanning Electron Microscope and Transition-Edge Sensor Spectrometer
Authors:
Nathan Nakamura,
Paul Szypryt,
Amber L. Dagel,
Bradley K. Alpert,
Douglas A. Bennett,
W. Bertrand Doriese,
Malcolm Durkin,
Joseph W. Fowler,
Dylan T. Fox,
Johnathon D. Gard,
Ryan N. Goodner,
J. Zachariah Harris,
Gene C. Hilton,
Edward S. Jimenez,
Burke L. Kernen,
Kurt W. Larson,
Zachary H. Levine,
Daniel McArthur,
Kelsey M. Morgan,
Galen C. O'Neil,
Nathan J. Ortiz,
Christine G. Pappas,
Carl D. Reintsema,
Daniel R. Schmidt,
Peter A. Schultz
, et al. (8 additional authors not shown)
Abstract:
X-ray nanotomography is a powerful tool for the characterization of nanoscale materials and structures, but is difficult to implement due to competing requirements on X-ray flux and spot size. Due to this constraint, state-of-the-art nanotomography is predominantly performed at large synchrotron facilities. We present a laboratory-scale nanotomography instrument that achieves nanoscale spatial res…
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X-ray nanotomography is a powerful tool for the characterization of nanoscale materials and structures, but is difficult to implement due to competing requirements on X-ray flux and spot size. Due to this constraint, state-of-the-art nanotomography is predominantly performed at large synchrotron facilities. We present a laboratory-scale nanotomography instrument that achieves nanoscale spatial resolution while changing the limitations of conventional tomography tools. The instrument combines the electron beam of a scanning electron microscope (SEM) with the precise, broadband X-ray detection of a superconducting transition-edge sensor (TES) microcalorimeter. The electron beam generates a highly focused X-ray spot in a metal target held micrometers away from the sample of interest, while the TES spectrometer isolates target photons with high signal-to-noise. This combination of a focused X-ray spot, energy-resolved X-ray detection, and unique system geometry enable nanoscale, element-specific X-ray imaging in a compact footprint. The proof-of-concept for this approach to X-ray nanotomography is demonstrated by imaging 160 nm features in three dimensions in 6 layers of a Cu-SiO2 integrated circuit, and a path towards finer resolution and enhanced imaging capabilities is discussed.
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Submitted 4 March, 2024; v1 submitted 20 December, 2022;
originally announced December 2022.
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Design of a 3000-pixel transition-edge sensor x-ray spectrometer for microcircuit tomography
Authors:
Paul Szypryt,
Douglas A. Bennett,
William J. Boone,
Amber L. Dagel,
Gabriella Dalton,
W. Bertrand Doriese,
Joseph W. Fowler,
Edward J. Garboczi,
Johnathon D. Gard,
Gene C. Hilton,
Jozsef Imrek,
Edward S. Jimenez,
Vincent Y. Kotsubo,
Kurt Larson,
Zachary H. Levine,
John A. B. Mates,
Daniel McArthur,
Kelsey M. Morgan,
Nathan Nakamura,
Galen C. O'Neil,
Nathan J. Ortiz,
Christine G. Pappas,
Carl D. Reintsema,
Daniel R. Schmidt,
Daniel S. Swetz
, et al. (6 additional authors not shown)
Abstract:
Feature sizes in integrated circuits have decreased substantially over time, and it has become increasingly difficult to three-dimensionally image these complex circuits after fabrication. This can be important for process development, defect analysis, and detection of unexpected structures in externally sourced chips, among other applications. Here, we report on a non-destructive, tabletop approa…
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Feature sizes in integrated circuits have decreased substantially over time, and it has become increasingly difficult to three-dimensionally image these complex circuits after fabrication. This can be important for process development, defect analysis, and detection of unexpected structures in externally sourced chips, among other applications. Here, we report on a non-destructive, tabletop approach that addresses this imaging problem through x-ray tomography, which we uniquely realize with an instrument that combines a scanning electron microscope (SEM) with a transition-edge sensor (TES) x-ray spectrometer. Our approach uses the highly focused SEM electron beam to generate a small x-ray generation region in a carefully designed target layer that is placed over the sample being tested. With the high collection efficiency and resolving power of a TES spectrometer, we can isolate x-rays generated in the target from background and trace their paths through regions of interest in the sample layers, providing information about the various materials along the x-ray paths through their attenuation functions. We have recently demonstrated our approach using a 240 Mo/Cu bilayer TES prototype instrument on a simplified test sample containing features with sizes of $\sim$1 $μ$m. Currently, we are designing and building a 3000 Mo/Au bilayer TES spectrometer upgrade, which is expected to improve the imaging speed by factor of up to 60 through a combination of increased detector number and detector speed.
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Submitted 14 December, 2022;
originally announced December 2022.